Specializing in TFT LCD and Capacitive Touch Screens.
+8613927418399 mkt@diseaelec.com

Annual production LCM 3,626,573 Pcs + CTP 802,138 Pcs

Manufacture

6 automated production lines：

These production lines are almost fully automated, including AOI testing equipment, backlight assembly machines, RTP assembly machines, automatic welding machines, etc.

Capacity：

We are a customized manufacturer, and our production capacity needs to be reserved for various models. Our full capacity far exceeds the actual output, so the production capacity is sufficient.

Plant & Capacity

Plant & Capacity

Plant & Capacity

  • Plant area: Over than 23,700m²
  • LCM Capacity: 2,000,000PCS/Mth.(Max.)
  • CTP Capacity: 80,000PCS/Mth.(Max.)
Equipment Information

Equipment Information

  • 2 Glass cutting lines
  • 3 lines for polarizing films
  • 6 Automatic LCM production lines
  • 4 automatic backlight assembly equipment.
  • Additionally: AOI testing equipment,
  • RTP assembly equipment,
  • automatic welding equipment, etc
Product Line

Product Line

  • Product Size:1.4 inch-15.6inch
  • LCM Type: COG/COG with PCBA
  • CTP Type:GG/GF/GFF

Automation Equipment Cluster for TFT Division

Diesa's production process is almost entirely completed by equipment, representing the advanced level in TFT LCD module manufacturing industry today.

POG Process

1. LCD substrate glass cutting New

1. LCD substrate glass cutting

2. Small pieces glass put in baskets

2. Small pieces glass put in baskets

3. Small piece glass 8 tanks washing + drying New

3. Small piece glass 8 tanks washing + drying

4. LCD electrical test

4. LCD electrical test

5. LCD washing

5. LCD washing

6. Equipment Attached Polarizers New

6. Equipment Attached Polarizers

7. POG defoaming

7. POG defoaming

8. POG electrical test

8. POG electrical test

FOG Process

9. POG Loading equipment

9. POG Loading equipment

10. LCD step plasma washing

10. LCD step plasma washing

11. ACF attachment

11. ACF attachment

12. IC bonding

12. IC bonding

13. FPC bonding

13. FPC bonding

14. AOI particle inspection New

14. AOI particle inspection

15. FOG electrical test

15. FOG electrical test

16. Equipment dispense glue

16. Equipment dispense glue

LCM Process

17. Automatic drying

17. Automatic drying

18. Automatic assembly backlighting New

18. Automatic assembly backlighting

19. Automatic assembly RTP New

19. Automatic assembly RTP

20. Automatic soldering New

20. Automatic soldering

21. Equipment pull handle

21. Equipment pull handle

22. LCM finished electrical measurements

22. LCM finished electrical measurements

23. Testing in the darkroom

23. Testing in the darkroom

24. Product Coding

24. Product Coding

CTP Process

25. Sensor plasma washing

25. Sensor plasma washing

26. Sensor ACF attachment

26. Sensor ACF attachment

27. Sensor FPA bonding

27. Sensor FPA bonding

28. Capacitive screen FOG electrical test and program burning

28. Capacitive screen FOG electrical test and program burning

29. Cover lens OCA bonding

29. Cover lens OCA bonding

30. CTP defoaming

30. CTP defoaming

31. CTP scribing test

31. CTP scribing test

32. CTP UV solidify

32. CTP UV solidify

Packing Process

33. Cover inspection and cleaning

33. Cover inspection and cleaning

34. LCM optical bonding

34. LCM optical bonding

35. Accessories assembly

35. Accessories assembly

36. Exterior cleaning and applying protective film

36. Exterior cleaning and applying protective film

37. OQC final quality control

37. OQC final quality control

38. Wrapping the LCM

38. Wrapping the LCM

39. Packing

39. Packing

40. Warehouse

40. Warehouse

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